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TC9400/9401/9402
DS21483D-page 20
?2007 Microchip Technology Inc.
14-Lead Plastic Dual In-Line (PD)  300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
. ?Significant Characteristic.
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:  For the most current package drawings, please see the Microchip Packaging Specification located at 
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits   MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
.100 BSC
Top to Seating Plane
A


.210
Molded Package Thickness
A2    .115
.130
.195
Base to Seating Plane
A1    .015


Shoulder to Shoulder Width
E    .290
.310
.325
Molded Package Width
E1    .240
.250
.280
Overall Length
D    .735
.750
.775
Tip to Seating Plane
L    .115
.130
.150
Lead Thickness
c    .008
.010
.015
Upper Lead Width
b1    .045
.060
.070
Lower Lead Width
b    .014
.018
.022
Overall Row Spacing ?/DIV>
eB    

.430
N
E1
D
NOTE 1
1  2
3
E
c
eB
A2
L
A
A1
b1
b
e
MicrochipTechnologyDrawingC04-005B
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